Ceramic PCB China for High Thermal Applications

WellPCB manufactures ceramic PCBs using aluminum oxide (Al₂O₃) with thermal conductivity from 24 to 30 W/mK (14 to 17 BTU/hr·ft·°F), aluminum nitride (AlN) at 170 to 230 W/mK (98 to 133 BTU/hr·ft·°F), and silicon carbide substrates for extreme performance applications.

Our ceramic materials feature breakdown voltage specifications from 10 to 50 kV/mm, dielectric loss factors below 0.0002, and a low coefficient of thermal expansion ranging from 4 to 7 ppm/°C to minimize stress during temperature cycling.

Base material selection includes CTE matching calculations and cost performance analysis to optimize thermal properties for specific high power electronic device requirements.

Thick film metallization using screen printing techniques with conductor paste deposition achieving line widths down to 4 mil (0.1mm) for ceramic substrate circuit patterning and component attachment areas.

Thin film processing through sputtering and electroplating creates copper traces with thicknesses ranging from 0.5 to 5 oz/ft² (17 to 170 μm) on ceramic base materials, enabling fine-pitch routing for high-frequency applications.

Electroless plating and electroplating processes deposit copper, nickel, and gold layers with a thickness control to ±10% tolerance, ensuring reliable electrical connections and surface finish quality for ceramic PCB assembly operations.

Thermal via drilling using laser cut precision techniques with diameters from 0.1 to 0.3mm (4 to 12 mil) for efficient heat dissipation pathways in high-power ceramic PCBs.

Heat sink attachment processing includes mechanical mounting and thermal interface material application for electronic devices requiring enhanced thermal conductivity performance up to operating temperatures of 300°F (150°C).

Thermal pathway optimization through copper filling and plating ensures consistent thermal properties across ceramic substrate PCB areas, with thermal resistance validation testing conducted in accordance with ASTM standards for high power electronic applications.

We support single sided to 64-layer ceramic circuit configurations with sequential lamination and via structures, including laser cut microvias, blind and buried vias and via-in-pad designs.

Our fabrication process achieves a wall metallization thickness of ≥25 μm (1 mil), with aspect ratios of up to 8:1, for high-frequency and RF applications requiring controlled impedance.

All via structures in hybrid ceramic PCBs are thermally stress-tested per IPC-TM-650 standards to verify reliability under thermal expansion forces.

Surface finish treatments include thick film ceramic PCB gold metallization (2 to 5 μm), thin film ceramic PCB sputtered finishes, and solderable coatings matched to final assembly requirements.

The finish selection process considers reflow temperatures of up to 500°F (260°C), environmental exposure constraints, and electrical insulation requirements for high-power electronic applications.

Quality control protocols verify surface finish thickness, adhesion strength, and solderability following IPC standards for ceramic PCB supplier qualification.

Each ceramic PCB undergoes optical resolution verification (AOI, 5 μm resolution), X-ray cross sectioning of vias and internal layers, and thermal conductivity measurement for performance validation.

Advanced ceramic testing includes thermal cycling from -85 to 300°F (-65 to 150°C), dielectric breakdown testing, and dimensional stability verification following aerospace qualification standards.

Material selection validation covers CTE measurement, thermal properties characterization, and electrical insulation testing to ensure high quality ceramic PCBs meet application requirements.

Production supports rapid prototyping (as short as 2 weeks for standard ceramic substrate builds) and batch runs of up to 10,000 units, with full quality control and traceability.

Each ceramic PCB manufacturing job includes complete documentation (material lot tracking, process records, test logs) and is managed under ISO 9001:2015 standards.

Statistical process control (SPC) ensures consistency in thermal conductivity via registration and circuit accuracy across all ceramic PCBs production volumes.